Photonic packaging

First generation of packaged opto-electronic components for space applications were developed within the project.

 

G&H has successfully packaged and pigtailed the high-power DFB laser chips developed by III-V LAB in the frames of the HIPPO project. The process controls are in place and the assembly processes rely on organic-free, fully hermetic devices suitable for the stringent space flight environment.

 

 

The current devices verify the process build and set the basis for packaging the final chips fabricated by III-V LAB during the last phase of the project. The packaged device outputs more than 80mW and the total power consumption at 25degC is less than 1.2Watt.